LED
Laser lift-off System 이동
LSP-150 system
- System description
- Laser lift off system for separating between wafer & sapphire
- Essential process equipment for light emitting diode
- Full auto separating between wafer & sapphire
- Full auto system from load to unload
- Excellent performance in good homogeneity of square beam without chip defects
- Multi-motion control with high moving speed
- Optimized system design internal process
HLSP-150 system
- System description
- Laser lift off system for separating between wafer & sapphire
- Essential process equipment for light emitting diode
- Full auto separating between wafer & sapphire
- Full auto system from load to unload
- High throughput with 4 process zone
- Warpage wafer process using thermal chuck
- Excellent performance in good homogeneity of square beam without chip defects
- Multi-motion control with high moving speed
- Optimized system design internal process