장비사업

LED Laser lift-off System 이동

LSP-150 system

System description
Laser lift off system for separating between wafer & sapphire
Essential process equipment for light emitting diode
Full auto separating between wafer & sapphire
Full auto system from load to unload
Excellent performance in good homogeneity of square beam without chip defects
Multi-motion control with high moving speed
Optimized system design internal process

HLSP-150 system

System description
Laser lift off system for separating between wafer & sapphire
Essential process equipment for light emitting diode
Full auto separating between wafer & sapphire
Full auto system from load to unload
High throughput with 4 process zone
Warpage wafer process using thermal chuck
Excellent performance in good homogeneity of square beam without chip defects
Multi-motion control with high moving speed
Optimized system design internal process